| Thermal evaporation | An electrical current heats a source material in a boat, basket, or crucible until it vaporizes and condenses on the substrate in a vacuum. | Commonly evaporated metals such as aluminum, silver, gold, and copper; some materials require specialized sources or process conditions. | Relatively simple equipment; suitable for many thin metal films; often offers high deposition rates for readily evaporated materials. | High-melting-point or compound materials can be difficult to evaporate without decomposition or composition changes. Line-of-sight geometry can limit coverage on complex shapes. | Decorative metal films, optical layers, electrical contacts, and laboratory-scale thin-film deposition. |
| Electron-beam evaporation | A focused electron beam heats material in a water-cooled hearth or crucible, generating vapor that travels to and condenses on the substrate. | Refractory metals and other high-melting-point materials, including titanium, chromium, and many oxide materials when suitable process controls are used. | Concentrated heating can evaporate materials with higher melting points; multiple hearth pockets can support material changes in some systems. | Equipment is generally more complex than resistance evaporation. X-rays, spitting, and film stress may require process and equipment controls. | Optical coatings, semiconductor research, wear-resistant films, and coatings using high-melting-point materials. |
| Magnetron sputtering | A plasma accelerates ions toward a target; ejected target atoms travel through the chamber and deposit as a film. Magnetic fields help confine electrons near the target. | Metals, alloys, and, with reactive gas or compound targets, materials such as oxides and nitrides. | Good control over film composition and thickness; broadly applicable to conductive materials and reactive coating processes. | Requires a plasma and process-gas control. Deposition conditions, target material, and geometry affect rate, uniformity, and film properties. | Architectural glass, displays, tools, electronics, and functional metal or compound coatings. |
| Ion plating | A vaporized coating material is combined with a plasma; energetic ions bombard the substrate and growing film during deposition. | Metals and compound coatings, including some nitrides and carbides, depending on the source and reactive-gas process. | Ion bombardment can improve film adhesion and density compared with unassisted evaporation in suitable processes. | More process-intensive than basic evaporation; ion energy and substrate heating must be controlled to avoid damage or excess stress. | Wear-resistant tools, components, and decorative or functional coatings that benefit from strong film adhesion. |